How has the ZIP changed the way you work with clients, especially when explaining failure analysis results?
A huge part of failure analysis is communication – helping clients understand where the failure occurred and why. Often, we’re working with SEM images or high-magnification techniques, and without context, these can be difficult for clients to interpret. The ZIP solves that. It lets us show an entire cross-section live on screen and then zoom into areas of interest. That visual clarity helps clients connect the dots between microscopic features and real-world components. It’s meant fewer follow-ups, faster answers, and more confidence in our findings.
The ability to go from an overview of a component to a pinpoint crack or fault live, and with the client watching, is incredibly powerful. It’s changed the way we communicate technical insights.
Can you share any specific case examples where the ZIP proved especially useful?
Absolutely. One great example was during a wafer handling and die selection investigation. We used the ZIP to identify signs of mechanical stress, surface contamination, and minor misalignments that were leading to pick-and-place issues. The large working distance meant we could physically interact with the sample under magnification, removing or adjusting dies in real-time while keeping everything in view.
In another case, we used the ZIP during a failure analysis of a semiconductor package. We could show the full package cross-section and then zoom in on specific delamination areas. That level of context helped our client immediately understand the root cause.